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Nov 2007

Curriculum Vitae

WERNER ENGELMAIER

ADDRESS AND PHONE
Personal:
7 Jasmine Run
Ormond Beach, Florida 32174-9205
Telephone: (386) 437-4614

Business:
7 Jasmine Run
Ormond Beach, Florida 32174-9205
Telephone: (386) 437-8747
Fax: (386) 437-8737
E-mail: Engelmaier@aol.com
Website: www.engelmaier.com

PERSONAL BACKGROUND

Born February 7, 1939, and raised in Vienna, Austria. Married to Dolores R. (Halouska) Engelmaier with two adult children.

EDUCATION

MASSACHUSETTS INSTITUTE OF TECHNOLOGY, Cambridge, MA (1965-1966).

Received Master of Science Degree in Mechanical Engineering in June 1966, earned 4.64 GPA out of 5.0, Thesis: Thermionic and Absorption Characteristics of a Single-Crystal Tungsten Filament Exposed to Oxygen.

UNIVERSITY OF SOUTH CAROLINA, Columbia, SC (1962-1965).

Received Bachelor of Science Degree 'Cum Laude' in January 1965, earned 3.74 GPA out of 4.0.
Majored in Mechanical Engineering with a minor in International Studies.

TECHNOLOGISCHES GEWERBE-MUSEUM, Vienna, Austria (1953-1958).

Earned 'Ingenieur'-Degree with 'Highest Honors' in Mechanical Engineering in June 1958.

Other Advanced Education:

NEW YORK UNIVERSITY (April 1981)
Short Course: Injection Molding.
GEORGE WASHINGTON UNIVERSITY (April 1978)
Short Course: Metal Fracture and Fatigue.
BELL LABSS/CITY COLLEGE OF NEW YORK (September-December 1978)
Course: Mechanical Engineering Design Problems in Industry.
BELL TELEPHONE LABORATORIES (January- May 1974)
Course: Mechanical Behavior of Materials.
BELL TELEPHONE LABORATORIES (September- May 1969)
Course: Design of Experiments.
STEVENS INSTITUTE OF TECHNOLOGY (September-December 1967)
Course: Conduction Heat Transfer.
STEVENS INSTITUTE OF TECHNOLOGY (September-December 1967)
Course: Heat Transfer in Space.
BELL TELEPHONE LABORATORIES (January- May 1967)
Course: Numerical Analysis.
BELL TELEPHONE LABORATORIES (September- December 1966)
Course: Numerical Methods for Engineers and Scientists.
NEWARK COLLEGE OF ENGINEERING (September 1966-January 1967)
Course: Probability Theory.
NEWARK COLLEGE OF ENGINEERING (September- December 1966)
Course: Mathematical Statistics.
THE EPPLEY LABORATORY, INC., Newport, RI (August 1966)
Short Course: Fundamental Radiometry for Experimental Scientists.

CERTIFICATION

PROFESSIONAL 'INGENIEUR' LICENSE (October 1962)
Government of the Republic of Austria.

PATENTS

U.S. 4,412,123: Laminated Electric Heat Generating Member for Reflow Soldering Devices, 1983.
U.S. 4,043,891: Electrolytic Cell with Bipolar Electrodes, 1977.

SECURITY CLEARANCE

Top Secret until 1972.

SPECIAL SKILLS

Fluent in German.
Emergency Medical Technician (EMT), certified until 1992.

LITIGATION/ARBITRATION EXPERIENCE

JERILYNN PAYNE, ON BEHALF OF HERSELF AND ALL OTHERS SIMILARLY SITUATED, v. FUJIFILM U.S.A., INC. d/b/a FUJI PHOTO FILM USA, INC.,
Class Action Case No. 2:07-cv-385-JAG-MCA, U.S. District Court for the District of New Jersey, civil action litigation, testifying expert for plaintiff, Green & Pagano, LLP, East Brunswick, NJ, January 2009-open, Disposition: Open.

CALAMP CORP. v. ROGERS CORPORATION and DOES 1-10,
Class Action Case No. CV073214, U.S. District Court Central District of California (Western Division), civil action litigation, testifying expert for defendant, Burns & Levinson, LLP, Boston, MA, November 2007-January 2008, Disposition: Settlement after Expert Report.

BRIAN SHARPLIN, ON BEHALF OF ALL OTHERS SIMILARLY SITUATED v. GATEWAY, INC.,
Class Action Case No. SACV 07-81 JVS(ANx), U.S. District Court Central District of California (Southern Division), civil action litigation, testifying expert for plaintiff, Shepherd, Finkelstein, Miller & Shah, LLC, Media PA, November 2007-January 2008, Disposition: Settlement after Expert Reports .

MARTIN HAPNER, INDIVIDUALLY AND ON BEHALF OF ALL OTHERS SIMILARLY SITUATED AND THE GENERAL PUBLIC v. SONY ELECTRONICS, INC.,
Class Action Case No. GIC839244, Superior Court of the State of California for the County of San Diego, class action litigation, testifying expert for plaintiff, Fee, Smith, Sharp & Vitullo, L.L.P., Dallas, TX, September 2006-August 2009, Disposition: Settlement after Expert Report , Deposition, and 2^nd Expert Report.

TESSERA, . INC. v. SPANSION INC ., SPANSION TECHNOLOGY INC., & SPANSION LLC; ADVANCED MICRO DEVICES INC., ADVANCED SEMICONDUCTOR ENGINEERING, INC. and ASE (U.S.) INC.; CHIPMOS TECHNOLOGIES INC. and CHIPMOS U.S.A., INC.; SILICONWARE PRECISION INDUSTRIES CO., LTD. and SILICONWARE USA INC; STMICROELECTRONICS N.V. and STMICROELECTRONICS, INC.; & STATS CHIPPAC LTD., STATS CHIPPAC, INC. and STATS CHIPPAC (BVI) LIMITED,
Civil Action Case No. C 05-04063 CW (EDL), U.S. District Court of the State of California (Northern District-San Francisco Division), commercial loss & patent litigation, testifying expert for Tessera, Inc., Irell & Manella, LLP, Los Angeles, CA, September 2006-May 2009, Disposition: Open ITC Investigation No. 337-TA-605 in Tessera's favor.

FOXCONN ELECTRONICS, INC. & HON HAI PRECISION INDUSTRY CO. v. LOTES CO., LTD.,
Civil Action Case No. 2-05CV-265, U.S. District Court for the Eastern District of Texas, Marshall Division, patent litigation, consulting expert for Lotes Co., Ltd., Torp, Pruner & Hu, P.C., Houston, TX, July 2006-August 2006, Disposition: Services terminated due to non-payment of invoices by Torp, Pruner & Hu, P.C. after settlement.

TESSERA, . INC. v. INFINEON TECHNOLOGIES AG; INFINEON TECHNOLOGIES RICHMOND, LP; INFINEON TECHNOLOGIES NORTH AMERICA CORP; MICRON TECHNOLOGY, INC. & MICRON SEMICONDUCTOR PRODUCTS, INC.
Civil Action Case No. 2-05CV-94, U.S. District Court for the Eastern District of Texas, Marshall Division, commercial loss & patent litigation, testifying expert for Tessera, Inc., Irell & Manella, LLP, Los Angeles, CA, May 2005-August 2006, Disposition: Settlement prior to Expert Report and Deposition .

FCI USA, INCORPORATED & FCI AMERICAS TECHNOLOGY, INCORPORATED v. SAMTEC INCORPORATED,
Civil Action Case No. IP01-1764C-B/S, U.S. District Court of the Southern District of Indiana, consulting expert for Samtec, Incorporated, Gardner Carton & Douglas, Chicago, IL, February 2003-August 2003, Disposition: Settlement prior to Expert Report and Deposition .

INTEL . CORPORATION v. BROADCOM CORPORATION
Civil Action Case No. 00-796 (RRM), U.S. District Court of the District of Delaware, and Civil Action Case No. CV-00-3702, U.S. District Court of the State of California (Northern District-San Francisco Division), consulting expert for Broadcom Corporation, Wilson Sonsini Goodrich & Rosati, Palo Alto, CA, January 2001-October 2003, Disposition: Settlement prior to Expert Report and Deposition.

INTEL . CORPORATION v. VIA TECHNOLOGIES, INC. (TAIWAN) & VIA TECHNOLOGIES, INC. (USA),
Civil Action Case No. C99-03062 WHA (JL), U.S. District Court of the State of California (Northern District-San Francisco Division), commercial loss & patent litigation, consulting expert for Via Technologies, Inc., Wilson Sonsini Goodrich & Rosati, Palo Alto, CA, July 2000-July 2001 , Disposition: Settlement prior to Expert Report and Deposition .

TEXAS INSTRUMENTS INCORPORATED v. TESSERA, . INC. AND RELATED COUNTERCLAIMS,
Civil Action Case No. C-00-02114 CW, U.S. District Court of the State of California (Northern District-Oakland Division), commercial loss & patent litigation, testifying expert for Tessera, Inc., Fish & Neave, New York City & Palo Alto, [ Wilson Sonsini Goodrich & Rosati, Palo Alto, CA ], April 2000-January 2002, Disposition: Settlement after Expert Report, Rebuttal Expert Report, Supplemental Expert Report, and Deposition.

TESSERA, . INC. v. SHARP CORPORATION (JAPAN) & SHARP ELECTRONICS CORPORATION (U.S.), SHARP CORPORATION (JAPAN) & SHARP ELECTRONICS CORPORATION (U.S.) v. TESSERA, . INC.
Arbitration Investigation No. 337-TA-432, U.S. . , Washington, D.C. and Civil Action Case No. C 00-20337-JW (EAI), U.S. District Court of the State of California (Northern District-San Jose Division), patent litigation, testifying expert for Tessera, Inc., Wilson Sonsini Goodrich & Rosati, Palo Alto, CA, April 2000-April 2001, Disposition: Bench Trial after Expert Report, Rebuttal Expert Report, and Depositions (2).

ROBERT FIOCCO, on behalf of all others similarly situated v. THOMSON CONSUMERS ELECTRONICS, INC., APPLIANCE DEALERS COOPERATIVE
Civil Action No. MID-L-1934-00, Superior Court of the State of New Jersey, Law Division, Middlesex County;

SCOTT BAIRD, et al, on behalf of themselves and all others similarly situated v. THOMSON CONSUMERS ELECTRONICS, INC.,
Case No. 00-L-00761, Circuit Court of Madison County, State of Illinois; Class Action litigation, testifying expert for the plaintiff, Galex, Tortoreti & Tomes, P.C., East Brunswick, NJ, and Kantrowitz, Goldhamer & Graifman, P.C., Chestnut Ridge, NJ, January 2000-June 2001, Disposition: Settlement prior to Expert Report and Deposition.

APPLE COMPUTER, INC. v. TATUNG COMPANY, Taiwan R.O.C., TATUNG COMPANY, Taiwan R.O.C. v. APPLE COMPUTER, INC.,
Arbitration Case No. 10099AER, International Court of Arbitration of the International Chamber of Commerce, Santa Clara County, CA, commercial loss arbitration, testifying expert for Tatung Co., Arter & Hadden LLP, San Diego, CA, August 1999-July 2000, Disposition: Mediation settlement prior to Expert Report and Deposition.

COMTEL ELECTRONICS, INC. v. TADPOLE TECHNOLOGY CORP.,
Arbitration Case No. NO81620, Judge Irving (ret), San Diego, CA, for commercial loss, testifying expert for plaintiff, June 1999-September 1999, Disposition: Settlement after Expert Report.

GENERAL MOTORS TRUCK GROUP v. ITT AUTOMOTIVE, INC.,
Two-party arbitration for commercial loss, consulting and testifying expert for ITT Automotive, Auburn Hills, MI, May 1998-September 1998, Disposition: Settlement after Expert Report and NHTSA ordered recall.

BROADBAND TECHNOLOGIES, INC. v. INTERNATIONAL POWER DEVICES, INC.,
Civil Action No. 1:96CV00124, U.S. District Court, Middle District-Durham Division, North Carolina, commercial loss litigation, consulting expert for the plaintiff, Kilpatrick Stockton LLP, Raleigh, NC, January 1998-May 1998, Disposition: Settlement prior to Expert Report and Deposition.

KLA INSTRUMENTS CORP. v. ANTHEM ELECTRONICS, INC., SANMINA CORP. AND DOES 1 through 50,
Civil Action No. CV 736423, Superior Court of The State of California for the County of Santa Clara, commercial loss litigation, testifying expert witness for the defendant Sanmina Corp., Wilson Sonsini Goodrich & Rosati, Palo Alto, CA, January 1996-February 1996, Disposition: Settlement prior to Expert Report and Deposition.

GOLDEN SYSTEMS, INC. v. BELL ATLANTIC BUSINESS SYSTEMS SERVICES, INC.,
Civil Action No. CIV 155 714, Superior Court of The State of California for the County of Ventura, commercial loss litigation, testifying expert witness for the plaintiff, Riordan & McKinzie, Los Angeles, CA, Ritchey Fisher Whitman & Klein, Palo Alto, CA, December 1995-April 1996, Disposition: Settlement after Expert Report.

CERBERUS TECHNOLOGIES, INC. v. APPLIED CIRCUITS, INC.,
Civil Action No. MRS-L-2221-93, Superior Court of New Jersey, Law Division-Morris County, commercial loss litigation, testifying expert witness for the plaintiff, Stephens Hogan & Rossi, Brewster, NY, September 1995-March 1996, Disposition: Settlement after Expert Report and Deposition.

INTERNATIONAL BUSINESS MACHINES CORPORATION v. COMDISCO, INC.,
Civil Action No. 91-C-6777, U.S. District Court, Northern District, Illinois, liability litigation, testifying expert witness for the defendant, Jenner & Block, Chicago, December 1993-September 1994, Disposition: Settlement prior to Expert Report and Deposition.

VITRONICS CORPORATION v. CONCEPTRONIC, INC.,
Civil Action No. C-91-696L, U.S. District Court, Concord, New Hampshire, patent litigation, testifying expert witness for the plaintiff, Wolf, Greenfield & Sacks, P.C., Boston, October 1991-August 1995, Disposition: Jury Trial after Deposition-Verdict reversed and remanded by U.S. Court of Appeals, Federal Circuit.
Civil Action No. C-91-696L (Re-Trial), U.S. District Court, Concord, New Hampshire, patent litigation, testifying expert witness for the plaintiff, Cohen, Pontani, Lieberman & Pavane, New York, February 1997-June 1999, Disposition: Settlement after Expert Declarations.

BUSINESS EXPERIENCE

ENGELMAIER ASSOCIATES, L.C., Ormond Beach, FL (formerly ENGELMAIER ASSOCIATES, Inc., Mendham, NJ). President since 1990.
Providing consulting services to the domestic and international PWB, Electronic Packaging, and Interconnection Technology industry. Engaged in consulting on electronic hardware design, manufacture, quality, and reliability evaluations, including trouble-shooting, failure analysis, testing, litigation support, and in-house training.
The clients of Engelmaier Associates have been and are many of the largest companies dealing with electronic hardware in North America and overseas.

UNIVERSITY OF MARYLAND, CALCE Center for Electronics Packaging, College Park, MD
Consulting Senior Research Scientist, from 1990 to 1993.
Providing practical input to electronics packaging research to academic programs and consortium activities.

AT&T BELL LABORATORIES, Whippany, NJ
Distinguished Member of Technical Staff, Interconnection Technology Laboratory, from 1966 to 1990.
Responsible for reliability aspects of electronic packaging interconnections in particular of solder joints, plated-through holes, flexible circuitry and multi-layer boards. This includes: research and development of particular assembly process steps, processing and material interactions, effect of use conditions, thermal management, materials and processing specifications; technology transfer to production facilities; troubleshooting and consulting; and external standards and specifications (a more detailed project description can be provided upon request).

RESEARCH LABORATORY OF ELECTRONICS (MIT), Cambridge, MA
Research Assistant, from 1965 to 1966.
Responsible for research in the Energy Conversion Laboratory supported by the Joint Services Electronics Program Contract and a NASA Grant.

UNIVERSITY OF SOUTH CAROLINA, Columbia, SC
Research Assistant, from 1964 to 1965.
Responsible for research in the Combustion Laboratory supported by NSF Grant.

UNIVERSITY OF SOUTH CAROLINA, Columbia, SC
Laboratory Technician, from 1962 to 1964.
Responsible for operation of Machine shop of the Engineering Department.

MASCHINENFABRIK AUGSBURG-NÜRNBERG, Augsburg, Germany
Test Engineer, from 1960 to 1962.
Responsible for getting marine and railroad Diesel engines, both standard and supercharged, ready for initial start-up, run-in, acceptance and certification.

KOLBEN-KRAUS AG, Vienna, Austria
Production and Development Engineer, from 1958 to 1960.
Responsible for process design and equipment selection for heat treatment procedures, supervision of pilot operations and Heat Treatment Department.

TEACHING EXPERIENCE

Numerous Tutorials and Workshops since 1985.

ASOLD 2008-Lead-Free & Mixed Technologies in SMT, Moscow, Russia.
BELL TELEPHONE LABORATORIES, various locations.
CEMCON, Budapest Hungary.
CEMCONEX, Timisoara, Romania.
EIDGENÖSSISCHE TECHNISCHE HOCHSCHULE, Lugano, Switzerland.
EIDGENÖSSISCHE TECHNISCHE HOCHSCHULE, Zurich, Switzerland.
EUROPEAN ELECTRONICS ASSEMBLY RELIABILITY SUMMIT, Tallinn, Estonia.
INT. ELEC. MANUF. TECH., Omiya, Japan.
ELEKTRONOIK RELIABLE CONFERENS, Stockholm, Sweden.
EXPIRA, Stockholm, Sweden.
FRAUNHOFER-INSTITUT, Bad Segeberg, Germany.
FRAUNHOFER-INSTITUT , Berlin, Germany .
FRAUNHOFER-INSTITUT, Thal, Switzerland.
GEORGIA INSTITUTE OF TECHNOLOGY, Atlanta, Georgia
HITACHI , Yokohama, Japan.
HUAWEI TECHNOLOGY COMPANY, Shenzhen, China.
INTERNEPCON, Brighton, England.
INTERNEPCON, Osaka, Japan.
INTERNEPCON, Glasgow, Scotland.
IPC, Zurich, Switzerland.
IPC National Electronics Week, London, U.K.
IPC Reliability Summit, Andover, MA.
IPC Webcast.
IPC/JEDEC, Austin, TX.
IPC/JEDEC, Berlin, Germany.
IPC/JEDEC, Boston.
IPC/JEDEC, Brussels, Belgium.
IPC/JEDEC, Frankfurt , Germany .
IPC/JEDEC, Montreal, Canada.
IPC/JEDEC, Raleigh, NC.
IPC/JEDEC, San Jose.
ISHM-Nordic, Oslo, Norway.
MEXITRONICA, Guadalajara, Mexico.
NASA/JPL, Pasadena, CA.
NATIONAL PHYSICAL LABORATORY (NPL), Teddington, U.K.
NATO/AGARD, Oslo, Norway.
NEC Corp, Kanagawaken , Japan .
PRODUCTRONICA, Munich, Germany.
PRONIC, Paris, France.
SURFACE MOUNT AND CIRCUIT BOARD ASSOC., Auckland & Christchurch, New Zealand; Melbourne, Sydney & Brisbane, Australia.
TECHNICAL UNIVERSITY, Helsinki, Finland.
TECHNISCHE UNIVERSITÄT, Munich, Germany.
TECHNOLOGISCHES GEWERBE-MUSEUM, Vienna, Austria.
TILFÖRLITLIGHET 2008, Stockholm, Sweden.
UNIVERSITY OF HELSINKI, Helsinki, Finland.
UNIVERSITY OF TORONTO, Toronto, Canada.
UNIVERSITY OF VIENNA, Vienna, Austria.
UPSTAR GROUP, Singapore & Bangkok, Thailand.
U.S. NAVY-NAVAL SURFACE WARFARE CENTER, Crane, IN.
ZENTRUM FÜR VERBINDUNGSTECHNIK, Oberpfaffenhofen, Germany.

Most Major Conferences in Electronic Packaging in the U.S.A.
Many of the largest companies dealing with Electronic Packaging in North America and Overseas.

PENN STATE UNIVERSITY, University Park, PA
Materials Research Institute Guest Lecturer, October 1993.
Electronic Packaging and Reliability.
COUNTY COLLEGE OF MORRIS, Dover, NJ
Instructor from 1969 to 1971.
Complete responsibility for courses on Applied Mathematics and Applied Calculus.

UNIVERSITY OF SOUTH CAROLINA, Columbia, SC
Laboratory Instructor from 1964 to 1965.
Organization and supervision of the laboratory section of the Engineering Materials course.

RICHLAND TECHNICAL EDUCATION CENTER, Columbia, SC
Instructor in 1964.
Organization and supervision of Technical Drawing course.

PROFESSIONAL ACTIVITIES AND MEMBERSHIPS

American Society of Mechanical Engineers (ASME), Life Member.
The Institute of Electrical and Electronics Engineers (IEEE), Component, Packaging & Manufacturing Technology Society, Computer Packaging Society--Compliant Lead Task Force (1983-1989),IEEE Consultants' Network of Northern New Jersey (1991-1997).
The Institute for Interconnecting and Packaging (IPC),
Chairman of Product Reliability Main Committee,
Chairman of SMT Accelerated Reliability Test Task Group,
Co-Chairman of SMT Solder Attachment Reliability Test Methods Task Group,
Co-Chairman of Solder Process Profiling Task Group,
Vice-Chair of Plated-Through Via Reliability-Accelerated Test Task Group,
Vice-Chair of Plated-Through Via Reliability-Design Task Group,
Chairman of Metallic Foil Subcommittee (1983-1989),
Chairman of Copper-Invar-Copper Task Group (1984-1986),
Co-Chairman of Copper Foil Specification Task Group (1984-1989),
IEC Steering Committee,
Technical Activities Executive Committee (TAEC),
Committee Chairman Council (CCC),
Consultants' Council,
SMT Reliability Design Task Group,
Soldering Subcommittee,
Flexible Circuits Committee,
Organic Base Substrates Subcommittee,
Surface Mount Land Pattern Subcommittee,
Test Methods Subcommittee,
Molded Printed Board Subcommittee.
International Electronics Packaging Society (IEPS).
Director of the Society (1995-1996).
International Microelectronics And Packaging Society (IMAPS), successor organization to merged IEPS and International Society for Hybrid Microelectronics (ISHM); Fellow and Life Member.
International Electrotechnical Commission (IEC).
Corresponding Member and Member of U.S. Technical Advisory Group to Technical Committee No. 52: Printed Circuits.
Corresponding Member and Member of U.S. Technical Advisory Group to Technical Committee No. 91: Surface Mounting Technology.
American Society for Testing Material (ASTM) (1979-1989),
Chairman of Ductility Testing Subcommittee (1983-1989),
Chairman of Definitions Subcommittee (1984-1989),
Secretary of Mechanical Testing Committee (1986-1988).
Surface Mount Technology Association (SMTA).
Editorial Advisory Board, Electronic Packaging & Production magazine (1985-1996).

HONORS AND AWARDS

TGM-EXNER-MEDAILLE-TECHNOLOGY EXNER-MEDAL"Dem Vorbild der Schüler," Technologisches Gewerbemuseum, Vienna, Austria, April 2009.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-7094 " Design and Assembly Process Implementation for Flip Chip and Die Size Components ," IPC-Association Connecting Electronics Industries, April 2009.
DISTINGUISHED COMMITTEE SERVICE AWARD for J-STD-075, "Classification of Non-IC Electronic Components for Assembly Processes," IPC-Association Connecting Electronics Industries, March 2009.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-7095B " Design and Assembly Process Implementation for BGAs ," IPC-Association Connecting Electronics Industries, September 2008.
DISTINGUISHED COMMITTEE LEADERSHIP AWARD for IPC/JEDEC-9703 " Testing Methodologies for Solder Joint Reliability in Shock Conditions ," IPC-Association Connecting Electronics Industries, September 2007.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-4101B "Specification for Base Materials for Rigid and Multilayer Printed Boards," IPC-Association Connecting Electronics Industries, September 2006.
COMMITTEE LEADERSHIP AWARD for IPC-9701A "Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments," IPC-Association Connecting Electronics Industries, September 2006.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-A-610D "Acceptability of Electronic Assemblies," IPC-Association Connecting Electronics Industries, February 2005.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC/JEDEC-9702 "Monotonic Bend Characterization of Board-Level Interconnect," IPC-Association Connecting Electronics Industries, October 2004...
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-7095A " Design and Assembly Process Implementation for BGAs ," IPC-Association Connecting Electronics Industries, October 2004.
IPC RAYMOND E. PRITCHARD HALL OF FAME AWARD for "his long-term contributions to IPC and to the electronic interconnection/packaging industry," IPC-Association Connecting Electronics Industries, September 2003.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-2221A "Generic Standard on Printed Board Design," IPC-Association Connecting Electronics Industries, March 2003.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-TR-486 "Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluation for Detecting the Presence of Inner-Layer Separations," The Institute for Interconnecting and Packaging Electronic Circuits (IPC), March 2002.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-9701 "Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments," The Institute for Interconnecting and Packaging Electronic Circuits (IPC), January 2002.
DISTINGUISHED COMMITTEE SERVICE AWARD for IPC-7530 "Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)," The Institute for Interconnecting and Packaging Electronic Circuits (IPC), October 2001.
SPECIAL RECOGNITION AWARD for "Prolific Technical Support of the IPC TechNet Forum," The Institute for Interconnecting and Packaging Electronic Circuits (IPC), October 1997.
OUTSTANDING COMMITTEE SERVICE AWARD for IPC-D-279 "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies," The Institute for Interconnecting and Packaging Electronic Circuits (IPC), March 1997.
FELLOW , International Microelectronics And Packaging Society (IMAPS), 1996.
PRESIDENT'S AWARD , The Institute for Interconnecting and Packaging Electronic Circuits (IPC), 1996.
BEST CONFERENCE PAPER AWARD, Surface. Mount International Conference (SMI), 1991.
BEST CONFERENCE PAPER AWARD, International Electronic Packaging Conference (IEPS), 1990.
ELECTRONIC PACKAGING ACHIEVEMENT AWARD , International Electronics Packaging Society (IEPS) and Electronic Packaging & Production magazine, 1987.
DISTINGUISHED MEMBER OF TECHNICAL STAFF AWARD , AT&T Bell Laboratories, 1986.
R&D-100 AWARD, Research & Development magazine, for Transverse Joulean-Heated Soldering Machine, 1981.
R&D-100 AWARD, Research & Development magazine, for Fatigue Ductility Flex Tester, 1978.
BEST CONFERENCE PAPER AWARD, IEEE Electronic Component Conference, 1971.
SIGMA XI, Research Honor Society, 1965.
PHI BETA KAPPA , Honor Society, 1964.
TAU BETA PI , Engineering Honor Society, 1964.

PUBLICATIONS

Over 200 publications primarily related to electronic packaging dealing with reliability, testing, design, materials, and processing aspects of surface mount technology, flexible printed wiring and multi-layer boards. Additional topics include fatigue, heat transfer, stress analysis, electrochemistry, solid lubrication, thermionic energy conversion and combustion. (See list of publications)

SOCIAL ANDCIVIC ACTIVITIES AND MEMBERSHIPS

Mendham Borough Board of Adjustment (1972-1975).
National Ski Patrol System (1970-1990).
Mendham Township First Aid Squad (1972-1990), served as Treasurer.
Bell Labs First Aid Squad (1973-1990), served as President.
Mendham Borough PTA (1970-1980), served as Treasurer.
Mendham Area Jaycees (1968-1970), served as Director.
Mendham Little League (1975-1980), served as Secretary.
FIFA Soccer Referee.
Plantation Bay Civic Association.
Jasmine Run Association, Director (1998-2002).
Plantation Bay Country Club.
Club de Bonmont Golf Club.
Prestwick Golf Club.
St. Mary's Catholic Church.
Knights of Columbus.
Honorable Order of Kentucky Colonels.

HOBBIES AND INTERESTS

Reading, skiing, golf, SCUBA diving, sailing, bicycling, fitness, tennis, classical music, traveling, soccer.